What is Chemical Peeling?

Chemical peeling is a purification process applied to renew the damaged or problematic layer of the skin. Different chemical substances used in chemical peeling are expected to peel the skin to different degrees. Depending on the peeling that occurs in the skin, the chemical peeling procedure is divided into 4 groups: very superficial, superficial, medium, and deep. 

EFFECTS OF CHEMICAL PEELING 

  • Skin renewal
  • Treatment of spots
  • Acne and acne scar treatment
  • Equalizing skin tone
  • Tightening pores
  • Reduction of fine wrinkles

WHAT PRODUCTS ARE USED? 

  • Phenol
  • TCA (Trichloroacetic Acid)
  • Enzymatic peels (Cosmelan, etc.)
  • Alpha hydroxy acids (glycolic acid, lactic acid, etc.)
  • Beta hydroxy acids (salicylic acid)
  • Polyhydroxy acids

CHEMICAL PEELING APPLICATION 

Usually, skincare is performed before peeling both for the smooth progress of the peeling and for its effectiveness. A suitable peeling solution is applied to the prepared skin, and it is left on the skin for 1-5 minutes depending on the solution. The eyes and nostrils are protected. After the desired time, the skin is cleansed with a neutralizing solution. It is generally a painless procedure, but a burning sensation and odor can be discomforting, and nostrils can be covered with cotton. A slight stinging sensation may be felt in superficial peels. Depending on the depth of peeling, peeling may occur for 2-7 days following the application. Usually, moisturizers are used to control this peeling. It is recommended to perform the procedure in the winter months. 

Chemical peeling applications, which last approximately 15-20 minutes, are performed for an average of 4-5 sessions with intervals of 21-30 days depending on the problem. To maintain the effect, it is recommended to repeat the treatment regimen every year. 

PRECAUTIONS 

  • Regular use of sunscreen before and after the procedure
  • Avoiding skin irritation
  • Using follow-up products according to your dermatologist’s recommendations.